RESIN COMPOSITION FOR FORMING HEAT-CURED FILM

摘要

[PROBLEMS] To provide a resin composition for heat-cured-film formation which can form a cured film having the property of aligning liquid crystals and realizing high transparency and high planarization. [MEANS FOR SOLVING PROBLEMS] The resin composition for heat-cured-film formation comprises ingredients (A) and (B). Ingredient (A): A polyimide precursor having structural units represented by the following formulae (1) and (2). Ingredient (B): A bismaleimide compound. (In the formulae, Ais an organic group including an alicyclic structure; Ais an organic group comprising a structure having an organic group including a structure formed by the fusion of an aliphatic ring with a benzene ring; at least one of Band Bis an organic group including the structure-SO-; and R, R, R, and Reach independently represents hydrogen or a Corganic group.)