| 摘要 |
Disclosed is a resin composition suitable for interlayer insulation of a flexible multilayer printed wiring board. Specifically disclosed is a resin composition for interlayer insulation of a multilayer printed wiring board, which contains the following components (A), (B) and (C). (A) a polyimide resin having a polybutadiene structure, a urethane structure and an imide structure in a molecule, while having a phenol structure at an end of the molecule (B) an epoxy resin (C) an inorganic filler having a specific surface area of 18-50 m/g. |
