发明名称 Electronic apparatus
摘要 <p>An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices (63), such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon (64) which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes (65) which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway (51) which is thermally coupled to the thermosiphon by the mounting of blades into a housing (2) and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser (55) which transfers the heat collected and transferred by the thermal highway outside a housing.</p>
申请公布号 EP2170030(A2) 申请公布日期 2010.03.31
申请号 EP20090252004 申请日期 2009.08.18
申请人 HITACHI LTD.;HITACHI PLANT TECHNOLOGIES, LTD. 发明人 MATSUSHIMA, HITOSHI;NAKAJIMA, TADAKATSU;ATARASHI, TAKAYUKI;KONDO, YOSHIHIRO;TOYODA, HIROYUKI;HAYASHI, TOMOO;IDEI, AKIO;TSUBAKI, SHIGEYASU;SUGIURA, TAKUMI;KASHIRAJIMA, YASUHIRO
分类号 H05K7/20 主分类号 H05K7/20
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