发明名称 |
Package method and structure for a light emitting diode multi-layer |
摘要 |
A package method and structure for a light emitting diode multi-layer module, wherein the method comprises the steps of: fabricating a printed circuit layer with a plurality of staggered nodes on a substrate; fabricating a frame around the substrate; fabricating a protruding inclined pier around the bottom rim of the inner wall of the frame; fabricating a plurality of convex reflecting microstructure points on the surface of the printed circuit layer; positioning chips and wire bonding; spraying reflecting paint on the surface of the substrate and the inner wall of the frame except the chips; filling a silica gel diffusion layer formed by mixing the silica gel and the diffusion powder into the frame; and evenly coating a fluorescent glue layer formed by evenly mixing another silica gel and fluorescent powder on the silica gel diffusion layer. |
申请公布号 |
GB2455843(B) |
申请公布日期 |
2010.03.31 |
申请号 |
GB20080016788 |
申请日期 |
2008.09.15 |
申请人 |
ILEDM PHOTOELECTRONICS INC;CHI-YUAN HSU |
发明人 |
CHI-YUAN HSU |
分类号 |
H01L25/075;F21K99/00;F21Y101/02;H01L33/50;H01L33/56;H01L33/60 |
主分类号 |
H01L25/075 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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