发明名称 Side under spoiler mounting structure
摘要 A side under spoiler mounting structure 1 that mounts a side spoiler 4 to a lower portion 6 of a vehicle body (2, figure 1) via a bracket 3 wherein the bracket is made of a material having a similar thermal expansion coefficient to that of a lower portion of a vehicle frame. The bracket is elongate in a front-rear direction of the vehicle and is bonded 7 to the lower part of the vehicle frame. The bracket is further provided with an insertion groove (35, figure 2a) that is configured to support the side under spoiler whereby the side under spoiler is provided with an attachment portion 9 that engages with the insertion groove of the bracket. The bracket may be manufactured from a material that thermally expands or thermally contracts equally to that of the lower portion of a vehicle frame. The side under spoiler, specifically its attachment portion, may be restricted against moving in the insertion groove of the bracket only in a vertical direction and in a width direction of the vehicle.
申请公布号 GB2463742(A) 申请公布日期 2010.03.31
申请号 GB20090003502 申请日期 2009.02.27
申请人 HONDA ACCESS CORP. 发明人 TAKAYUKI YANAGIDA;YOSHIMASA MISONOU;HIDEOMI TAMAI
分类号 B62D35/00;B60R13/04 主分类号 B62D35/00
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