| 摘要 |
A binding mixture is applied on a porous metal structure by spraying or dipping. The porous structure is placed against the substrate such that the mixture is disposed between the substrate and porous structure to form an assembly. The assembly is heated to metallurgically bond the porous structure and substrate in the attachment of the porous metal structure to metal substrate. An independent claim is included for attachment of a porous metal structure to a metal component of an orthopedic implant. |
