发明名称 Method of manufacturing an insulation substrate
摘要 Disclosed are an insulation substrate comprising: a conductive pattern that is provided on a surface of a ceramics substrate, wherein, of an external surface of a conductor constituting the conductive pattern, a rising surface that rises from the surface of the ceramics substrate substantially rises vertically with respect to a direction along the surface of the ceramics substrate, the conductive pattern is joined with the surface of the ceramics substrate by a brazing filler metal, and at least a lower part of the rising surface of the conductor in a direction in which the rising surface rises from the surface of the ceramics substrate is covered with the brazing filler metal, a method for manufacturing an insulation substrate and a power module comprising said insulation substrate.
申请公布号 EP2169717(A1) 申请公布日期 2010.03.31
申请号 EP20080162730 申请日期 2005.08.16
申请人 MITSUBISHI MATERIALS CORPORATION 发明人 NEGISHI, TAKESHI;NAGASE, TOSHIYUKI
分类号 H01L23/00;H01L21/48;H01L23/373;H05K1/03;H05K3/04;H05K3/20;H05K3/38 主分类号 H01L23/00
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