发明名称 |
Method of manufacturing an insulation substrate |
摘要 |
Disclosed are an insulation substrate comprising:
a conductive pattern that is provided on a surface of a ceramics substrate, wherein, of an external surface of a conductor constituting the conductive pattern, a rising surface that rises from the surface of the ceramics substrate substantially rises vertically with respect to a direction along the surface of the ceramics substrate, the conductive pattern is joined with the surface of the ceramics substrate by a brazing filler metal, and at least a lower part of the rising surface of the conductor in a direction in which the rising surface rises from the surface of the ceramics substrate is covered with the brazing filler metal,
a method for manufacturing an insulation substrate and
a power module comprising said insulation substrate. |
申请公布号 |
EP2169717(A1) |
申请公布日期 |
2010.03.31 |
申请号 |
EP20080162730 |
申请日期 |
2005.08.16 |
申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
NEGISHI, TAKESHI;NAGASE, TOSHIYUKI |
分类号 |
H01L23/00;H01L21/48;H01L23/373;H05K1/03;H05K3/04;H05K3/20;H05K3/38 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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