发明名称 MICROALIGNMENT USING LASER-SOFTENED GLASS BUMPS
摘要 <p>Disclosed is a method for fabricating glass bump standoff structures of precise height, the method comprising providing oversized glass bumps on a glass substrate, providing a heat source to heat the bumps, positioning a substrate to be aligned on the oversized bumps, and reducing the height of the oversized bumps by a combination of manipulations comprising (1) softening the bumps by heating the bumps and (2) applying pressure to the substrate to be aligned.</p>
申请公布号 EP2168001(A2) 申请公布日期 2010.03.31
申请号 EP20080794483 申请日期 2008.07.15
申请人 CORNING INCORPORATED 发明人 GRZYBOWSKI, RICHARD R;STRELTSOV, ALEXANDER M;SUTHERLAND, JAMES S
分类号 G02B6/42;C03B23/02;C03C15/00;C03C23/00;G02B6/30;G02B7/00;H01L21/60;H05K3/00;H05K13/04 主分类号 G02B6/42
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