发明名称 |
MICROALIGNMENT USING LASER-SOFTENED GLASS BUMPS |
摘要 |
<p>Disclosed is a method for fabricating glass bump standoff structures of precise height, the method comprising providing oversized glass bumps on a glass substrate, providing a heat source to heat the bumps, positioning a substrate to be aligned on the oversized bumps, and reducing the height of the oversized bumps by a combination of manipulations comprising (1) softening the bumps by heating the bumps and (2) applying pressure to the substrate to be aligned.</p> |
申请公布号 |
EP2168001(A2) |
申请公布日期 |
2010.03.31 |
申请号 |
EP20080794483 |
申请日期 |
2008.07.15 |
申请人 |
CORNING INCORPORATED |
发明人 |
GRZYBOWSKI, RICHARD R;STRELTSOV, ALEXANDER M;SUTHERLAND, JAMES S |
分类号 |
G02B6/42;C03B23/02;C03C15/00;C03C23/00;G02B6/30;G02B7/00;H01L21/60;H05K3/00;H05K13/04 |
主分类号 |
G02B6/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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