| 摘要 |
In a multilayer printed wiring board comprising a multilayer core (1) board having conductor layers in its innerlayer, and interlaminar resin (3) insulating layers and conductor layers alternately laminated on a substrate to form buildup wiring layer connecting the conductor layers through via-hole (12), the multilayer core board has a resin insulating layer covering the innerlayer conductor circuits formed on the core material, and a via-hole is formed in the resin insulating layer so as to arrive at the innerlayer conductor circuit through the layer, and a through-hole (10) is formed in the resin insulating layer and a filler (8) is filled in the through-hole. A part of the via-hole (19) in the buildup wiring layer is located just above the through-hole (10) and connected to the through-hole. Even if the core board is multilayered, there can be provided a multilayer printed wiring board suitable for the high densification of through-holes which can sufficiently ensure the electrical connection to the innerlayer circuits in the core board through the through-holes. |
