| 摘要 |
<p>An electromagnetic coupling module includes a feed circuit substrate having external coupling electrodes on both main surfaces thereof and a wireless IC chip. Radiation electrodes (22) and (32) are formed on a packaging body (30). The electromagnetic coupling module is disposed on a joint (9c) of the packaging body (30) so that the external coupling electrodes on both the main surfaces of the electromagnetic coupling module are coupled to the radiation electrodes (22) and (32), respectively. Thus, there is formed a wireless IC device that is resistant to shock or the like, easy to manufacture, and obtains stable characteristics and that allows easy reuse or replacement of an IC chip.</p> |
