发明名称 |
Propylene resin composition and molding thereof |
摘要 |
To provide a propylene resin composition excellent in both the electroconductivity and moldability and excellent in their balance, and a molded product thereof. A propylene resin composition comprising from 50 to 98 wt % of a propylene resin having a MFR of from 5 to 300 g/10 min, and from 2 to 50 wt % of carbon black having a 24M4DBP absorption of at least 130 cm3/100 g, a dehydrogenation amount of at most 1.2 mg/g at 1,500° C. for 30 minutes and a crystallite size (Lc) of from 10 to 17 Å. A propylene resin molded product which is a propylene resin molded product obtained by molding such a propylene resin composition and which has a volume resistivity of from 102 to 109 &OHgr;·cm and a MFR of from 1 to 80 g/10 min.
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申请公布号 |
US7687566(B2) |
申请公布日期 |
2010.03.30 |
申请号 |
US20050592797 |
申请日期 |
2005.02.04 |
申请人 |
MITSUBISHI CHEMICAL CORPORATION |
发明人 |
MATSUKI AKIHIRO;KANAMARU SHINICHI;FUKUYAMA YUTAKA;MISE NOBUTAKE;TAKAMURA EIHACHI;NAKAYAMA KOICHI |
分类号 |
B60C1/00;C01B31/02;C01D3/00;C08K3/04;C08K7/06;C08L23/10;C08L53/00;C09C1/48;C09C1/50 |
主分类号 |
B60C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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