MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CONDUCTIVE REFERENCE ELEMENT

摘要

PURPOSE: A microelectronic assembly including impedance controlled by a wire bonding and a conductive reference element is provided to obtain a wanted impedance value by connecting a conductive material to a source of reference potential. CONSTITUTION: A microelectronic device(110) includes a surface and a device contact exposed to the surface. A mutual connection device(130) includes a surface adjacent to the microelectronic contact and a plurality of element contacts. The plurality of conductive devices connects the device contact to the element contact. A conductive material includes a conductive surface.