| 摘要 |
A socket can be used for testing an integrated circuit package having a plurality of rows of leads. The socket includes a base that is aligned with a circuit board having a plurality of contact pads. A plurality of rows of contact fingers are electrically coupled to the plurality of contact pads, each of the plurality of rows of contact fingers for engaging a corresponding one of the plurality of rows of leads in response to a retention force applied to the integrated circuit package. Each of the contact finger has a cantilevered end that is supported by a supporting force generated by an elastic contact in response to the retention force.
|
