发明名称 Resistive memory device having array of probes and method of manufacturing the resistive memory device
摘要 Provided are a resistive memory device having a probe array and a method of manufacturing the same. The resistive memory device includes a memory part having a bottom electrode and a ferroelectric layer sequentially formed on a first substrate; a probe part having an array of resistive probes arranged on a second substrate, with the tips of the resistive probes facing the ferroelectric layer so as to write and read data on the ferroelectric layer; and a binding layer which grabs and fixes the resistive probes on or above the ferroelectric layer. The method of manufacturing the resistive memory device includes forming a bottom electrode and a ferroelectric layer sequentially on a first substrate; forming an array of resistive probes on a second substrate; and wafer level bonding the first substrate to the second substrate using a binding layer such that tips of the resistive probes face the ferroelectric layer.
申请公布号 US7687838(B2) 申请公布日期 2010.03.30
申请号 US20050240570 申请日期 2005.10.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HONG SEUNG-BUM;JUNG JU-HWAN;KO HYOUNG-SOO;PARK HONG-SIK;MIN DONG-KI;KIM EUN-SIK;PARK CHUL-MIN;KIM SUNG-DONG;BAECK KYOUNG-LOCK
分类号 H01L21/66;G11B3/00;G11B9/00;G11B11/00;H01L21/00 主分类号 H01L21/66
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