发明名称 Cooling apparatus having low profile extrusion and method of manufacture therefor
摘要 A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.
申请公布号 US7686069(B2) 申请公布日期 2010.03.30
申请号 US20070005710 申请日期 2007.12.28
申请人 THERMOTEK, INC. 发明人 PARISH, IV OVERTON L.;DEVILBISS ROGER S.
分类号 F28D15/02;F28F1/02;H01L23/427 主分类号 F28D15/02
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