| 发明名称 |
Process for removing material from a substrate |
| 摘要 |
A process for skiving a substrate is described, wherein the substrate is skived with a roller or a device or apparatus including the roller. The roller provides a cleaner skive than previously known methods without damage to underlying materials.
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| 申请公布号 |
US7685692(B2) |
申请公布日期 |
2010.03.30 |
| 申请号 |
US20040851913 |
申请日期 |
2004.05.21 |
| 申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
RANKIN, JR. CHARLES M.;RICKS THEODORE K.;WEINER MEGAN L.;MACAULEY JOHN P.;COLEMAN RUSTY J. |
| 分类号 |
B23P19/02;G03G15/14 |
主分类号 |
B23P19/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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