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发明名称
Electroless deposition from non-aqueous solutions
摘要
A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided.
申请公布号
US7686875(B2)
申请公布日期
2010.03.30
申请号
US20080338998
申请日期
2008.12.18
申请人
LAM RESEARCH CORPORATION
发明人
NORKUS EUGENIJUS;JACIAUSKIENE JANE;DORDI YEZDI
分类号
C23C18/38
主分类号
C23C18/38
代理机构
代理人
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