发明名称 Sharing conversion board for testing chips
摘要 The invention relates to a device interface board for testing chips, which is cooperatively installed with one of a plurality of probe cards. Each of the plurality of probe cards is provided with a specified wiring area and a first public signal area, the specified wiring area being electrically connected with the first public signal area. The first public signal area of each of the plurality of probe cards is located in a same particular area, and the specified wiring area of each of the plurality of probe cards is electrically connected with a testing jig and is different depending on a different testing jig. The device interface board comprises a chip test area and a second public signal area, in which the chip test area is used to carry a chip under test and is electrically connected with the second public signal area, whereby, through electrical connection between the device interface board and the first public signal area of each of the plurality of probe cards, test signals are transferred between the testing jig and the chip under test, and testing of chips under test having the same model are accomplished between different testing jigs.
申请公布号 US7688093(B2) 申请公布日期 2010.03.30
申请号 US20080153728 申请日期 2008.05.23
申请人 KING YUAN ELECTRONICS CO., LTD. 发明人 KO HSUAN-CHUNG;HSIEH CHEN-YANG
分类号 G01R31/02 主分类号 G01R31/02
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