| 摘要 |
A semiconductor device includes two semiconductor chips having different guarantee temperatures, which are individually mounted on two stages distanced from each other and are sealed with a resin mold. One semiconductor chip includes a heating circuit causing a heating temperature that is higher than the guarantee temperature of another semiconductor chip, and the backside of the stage thereof is exposed externally of the resin mold. This reduces the amount of heat transmitted from one semiconductor chip to another semiconductor chip, thus improving the reliability of the semiconductor device. Alternatively, two semiconductor chips having different heights are mounted on a single stage, wherein one semiconductor chip causing a high heating temperature is lowered in height in comparison with another semiconductor chip, thus increasing the heat-transmission path between the semiconductor chips and thus reducing the heat-dissipation path for dissipating heat of one semiconductor chip to a substrate. |
