SUBSTRATE PROCESS APPARATUS AND SUBSTRATE PROCESS METHOD

摘要

PURPOSE: A substrate processing apparatus and a method for treating substrates give the ultrasonic wave of the oscillation frequency. The crushing of micro cavity is practiced effectively. CONSTITUTION: An ultrasonic oscillator(20) is arranged in the process bath. The ultrasonic oscillator gives the ultrasonic wave about the liquid(L) including the micro cavity(H). A controller(100) obtains the natural frequency of micro cavity. An ultrasonic generator(19) obtains the information about the oscillation frequency from the natural frequency of micro cavity. It vibrates the ultrasonic oscillator to the oscillation frequency and the ultrasonic generator gives the ultrasonic wave to micro cavity.