发明名称 PUTTY COMPOSITION FOR HEATING ELEMENT AND HEATING PANEL USING THE SAME
摘要 PURPOSE: A putty composition for a heating element is provided to be used at a high temperature by forming an inorganic material layer without use of organic adhesives and not to discharge materials harmful to the human body. CONSTITUTION: A putty composition for forming a heat accumulator for a heating element comprises 10~100 parts by weight of jade powder, 10~60 parts by weight of silica sol, 10~40 parts by weight of alcohol, and 0.5~5 parts by weight of acid, and further includes 10~50 parts by weight of alkoxy silane. The average particle diameter of jade powder is 10~1000 mesh.
申请公布号 KR20100032587(A) 申请公布日期 2010.03.26
申请号 KR20080091546 申请日期 2008.09.18
申请人 THERMOPIA. CO., LTD. 发明人 HAN, SANG YONG
分类号 C09D1/00 主分类号 C09D1/00
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