| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a high-quality semiconductor chip by improving irregularity following performance at a wafer circuit surface, etc., in extremely thin grinding or the like of a wafer and suppressing the generation of adhesive residue even when grinding water, etc., is prevented from entering into the wafer circuit surface upon grinding. SOLUTION: In the state where an ultraviolet curing adhesive layer 16 of a surface protective sheet 12 having the ultraviolet curing adhesive layer 16 is pasted on the circuit surface of the wafer, the back surface of the wafer is ground, and the wafer is divided into a number of individual chips 20. The ultraviolet curing adhesive layer 16 of the surface protective sheet 12 is then exposed to UV rays to cure (curing process). In the curing process, both of a pasting surface 12A and a non-pasting surface 12B are exposed to UV rays as depicted by arrows A and B, to surely prevent a part of the ultraviolet curing adhesive layer 16 from remaining on ends, etc., of the chips 20. COPYRIGHT: (C)2010,JPO&INPIT
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