| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an alloy plating method and an alloy plating apparatus, by which alloy plating such as lead-free solder can be carried out without requiring a large-sized complicated apparatus or bringing about an increase in management cost, and by which measures against a substitution problem peculiar to alloy plating can be taken. Ž<P>SOLUTION: In the alloy plating method for plating an object to be plated with an alloy by electroplating, tanks the number of which is equal to the number of the kinds of metal elements constituting the alloy are arranged; soluble solid anodes made of the respective metal elements are put in plating solutions in the respective tanks; a cathode made of the object to be plated is put in the plating solution in one of the tanks or in a plating solution in a tank disposed in addition; each of the soluble solid anodes is electrically connected to the cathode through a rectifier; and an electric current is supplied to each of the soluble solid anodes in accordance with the alloy composition. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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