MEMS COMPONENT, METHOD FOR PRODUCING A MEMS COMPONENT, AND METHOD FOR HANDLING A MEMS COMPONENT

摘要

The invention relates to a MEMS component comprising a substrate (1) in which at least one cavity (2) is present. The cavity (2) is closed toward an active side of the substrate (1). An inactive side is disposed opposite the active side of the substrate (1), and the substrate (1) is covered by a covering film (3) on the inactive side. The invention further relates to a method for producing a MEMS component comprising the following steps. In the first step, cavities (2) are produced on a substrate wafer (1), wherein the cavities (2) are closed toward an active side and comprise an opening toward an inactive side. In a second step, a covering film (3) is applied to the inactive side of the substrate wafer (1), wherein the covering film (3) is glued to the substrate wafer (1) at least in the area of the substrate wafer (1) between the cavities (2).