| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit device to thinly coat the lower surface of an island with a sealing resin. <P>SOLUTION: The island 12 with which a semiconductor element 20 is rigidly combined is housed in the cavity 36 of a mold, and a resin sheet 42 containing a thermosetting resin is interposed between the island 12 and the lower surface of the inner wall of the mold 30. Under this condition, the mold 30 is heated up to about 180°C, and a liquid sealing resin is injected from a gate 44, and thereby, the lower surface of the island 12 can be thinly coated with the sealing resin formed of the molten resin sheet 42. <P>COPYRIGHT: (C)2010,JPO&INPIT |
