| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a bonding method and a bonding device, forming uniform loops at high speed, and to provide a manufacturing method. <P>SOLUTION: In the bonding device 1, a capillary 5 is lowered to a bonding position to bond an initial ball 10 to a pad 104 of an overhang die 100. At this time, at intervals of a prescribed time, a position of the capillary 5 on a Z axis direction is detected, and a load detected by a load sensor 7 is detected and stored. A load change point is detected by referring to stored loads acting on the capillary 5 and positions of the capillary 5, and the bonding position is subtracted from a load change position of the capillary 5 in this load change point to calculate a movement amount Z of the capillary 5 from the load change position to the bonding position. After the capillary 5 is raised by the calculated movement amount Z, a wire loop is formed between the pad 104 and a lead 105. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
