| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit device suppressing advance of exfoliation. <P>SOLUTION: An exfoliation suppressing means formed of a solder dam 22 is provided on the top face of a conductive pattern 16 in the vicinity of a semiconductor element 24. Specifically, the conductive pattern 16 is provided on the top face of an insulating layer 26 to coat the top face of a circuit board 12, and the conductive pattern 16 is coated with a solder resist 32. The semiconductor element 24 is rigidly combined with the conductive pattern 16 exposed from an opening part provided in the solder resist 32. The solder dam 22 is formed like a belt in the vicinity of the semiconductor element 24. Therefore, even if exfoliation between the conductive pattern 16 and the solder resist 32 occurs in the peripheral part of the semiconductor element 24, advance of the exfoliation is suppressed by this solder dam 22. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
