发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, PERMANENT MASK RESIST AND METHOD FOR PRODUCING PERMANENT MASK RESIST
摘要 <P>PROBLEM TO BE SOLVED: To provide: a photosensitive resin composition which is excellent in plating resistance, stability after lamination and reduction of development residues and can inhibit discoloration in soldering; a photosensitive film; a permanent mask resist; and a method for producing the permanent mask resist. <P>SOLUTION: The photosensitive resin composition includes (A) a polymerizable prepolymer having a carboxyl group and an ethylenically unsaturated group, (B) a carboxylic binder polymer, (C) a photopolymerizable compound, (D) a photopolymerization initiator, and (E) a heavy metal deactivator, wherein the heavy metal deactivator (E) includes one or more selected from the group consisting of salicylic acid derivatives, hydrazide derivatives or oxalic acid amide derivatives. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010066677(A) 申请公布日期 2010.03.25
申请号 JP20080234827 申请日期 2008.09.12
申请人 HITACHI CHEM CO LTD 发明人 OHASHI TAKESHI;YOSHIDA TETSUYA;OTOMO SATOSHI;OZAWA KYOKO;ITAGAKI SHUICHI
分类号 G03F7/004;G03F7/027;G03F7/033;H05K3/28 主分类号 G03F7/004
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