| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing semiconductors which has good adhesion to lead frames and semiconductor elements, a low modulus of elasticity and a high solder resistance, and a semiconductor device obtained by using the same. SOLUTION: The resin composition for sealing semiconductors includes (A) an epoxy resin mixture comprising a specific bisphenol A-type epoxy resin and a specific biphenyl-type epoxy resin, (B) a phenol resin mixture comprising a specific phenol resin and a specific phenol novolac resin, (C) an inorganic filler, and (D) a benzotriazole derivative expressed by formula (5). COPYRIGHT: (C)2010,JPO&INPIT
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