发明名称 FILM FORMING METHOD, THERMAL CONDUCTION MEMBER, POWER MODULE, VEHICLE INVERTER, AND VEHICLE
摘要 There is provided a film forming method capable of enhancing adhesion efficiency of a metal powder by use of a low-pressure compressed gas even in the case of spraying the metal powder remaining in a solid-phase state to a substrate, to form a film, the method being a film forming method of spraying a metal powder p in a solid-phase state to a surface 11a of a substrate 11 along with a compressed gas, to form a film 12 of the metal powder p on the surface 11a of the substrate 11, wherein a powder, which at least contains a powder for film formation having an apparent density of 1.4 to 2.0 g/cm3 and an average grain size of not larger than 25 μm, is used as the metal powder p.
申请公布号 US2010073883(A1) 申请公布日期 2010.03.25
申请号 US20080443055 申请日期 2008.06.11
申请人 TOYOTA JIDOSHA KABUSHIKI KAISHA 发明人 MIYAMATO NORITAKA;TSUZUKI YOSHIHIKO
分类号 H05K7/20;B05D1/12;B32B5/16;B32B5/18 主分类号 H05K7/20
代理机构 代理人
主权项
地址
您可能感兴趣的专利