| 摘要 |
An integrated circuit (IC) package is disclosed. The IC package includes a first substrate having a first surface having first substrate bond pads, a second surface having second substrate bond pads, and an opening that extends from the first surface to the second surface. The IC package further includes a first IC having a first IC surface that includes first bond pads and that is directly attached to the second surface of the first substrate, and a second IC surface. The first bond pads are accessible through the opening. The IC package also includes a second IC having a third IC surface that is directly attached to the second IC surface, and a fourth IC surface that includes second bond pads. At least one of the first bond pads is connected to at least one of the first substrate bond pads using one or more bond wires. At least one of the second bond pads is connected to at least one of the second substrate bond pads using one or more bond wires. The opening has a first side and a second side. The first substrate bond pads are located adjacent to only the first side of the opening.
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