COPPER WIRING SURFACE PROTECTIVE LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR CIRCUIT

摘要

Disclosed is a copper wiring material surface protective liquid for semiconductor device production, which contains an oxyalkylene adduct of acetylene diol obtained by adding an oxyalkylene having 2 or 3 carbon atoms to acetylene diol.  Also disclosed is a method for manufacturing a semiconductor circuit element, wherein there is formed a semiconductor substrate comprising a copper wiring which is obtained by forming a copper film by sputtering on a silicon substrate, which has been provided with an insulating film and/or a diffusion-preventing film, then forming copper wiring containing not less than 80% by mass of copper on the copper film by plating, and then planarizing the copper wiring by CMP (chemical mechanical polishing).  The method for manufacturing a semiconductor circuit element is characterized in that the semiconductor substrate, in which the copper wiring material surface is exposed, is subjected to a liquid contact treatment using the copper wiring material surface protective liquid.