SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package and a manufacturing method thereof, which can reduce a stress generated in a joining part joining a semiconductor device to a wiring substrate to prevent the joining part from cracking when the semiconductor package is heated.

SOLUTION: A semiconductor package 10 has a semiconductor device 20 mounted on a wiring substrate 30. The semiconductor device 20 includes a semiconductor chip 21, a through hole 23 passing through from one surface of the semiconductor chip 21 to the other surface, a through electrode 26 having one end fixed to the one surface of the semiconductor chip 21 and having the other end inserted to the through hole 23 without contacting a wall surface of the through hole 23 and protruded from the other surface of the semiconductor chip 21, and a connection terminal 27 formed on the other end of the through electrode 26. The connection terminal 27 is electrically connected to the wiring substrate 30.

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