发明名称 CONDUCTOR MODULE AND ELECTROMAGNETIC PRESSURE-WELDING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a conductor module and an electromagnetic pressure-welding method capable of lessening a jointing area of both conductors. <P>SOLUTION: Exposed holes 16 whose diameters are smaller than widths of conductors 13 wherein one face of each conductor 13 arranged on covering sections 15 of a pair of flexible printed circuits 11, 12 is exposed are piled up on each other. The pair of flexible printed circuits 11, 12 are arranged on a coil 21 while sandwiching a flying material 26 so that the exposed hole 16 is located at a peak point P<SB>12</SB>wherein the magnetic field component in a thickness direction of the flexible printed circuits 11, 12 among magnetic fields H generated from the coil 21 crossed with the conductive flying material 26 thicker than the conductor 13 serve as a peak. Then, both conductors 13 are electromagnetically pressure-welded by circulating current through the coil 21. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010067357(A) 申请公布日期 2010.03.25
申请号 JP20080229738 申请日期 2008.09.08
申请人 YAZAKI CORP 发明人 SUGIYAMA YOSHITAKA;HANAZAKI KENICHI;AIZAWA TOMOKATSU
分类号 B23K20/06;H01R4/02;H01R43/02;H05B6/10 主分类号 B23K20/06
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