发明名称 METHOD FOR INJECTING RESIN BOND AND DIRECTLY STICKING FLOOR PANEL WITH ADJUSTING MECHANISM
摘要 <P>PROBLEM TO BE SOLVED: To enable production of a low floor plywood substrate near an existing floor face by adjusting the height with adjusting bolts intermittently installed in a floor panel with an adjusting mechanism to the uneven parts of an RC floor slab at direct sticking to a floor and filling a resin bond into rule-shaped sheet groove portions in the lower part of a perforated panel plywood from injection holes in the upper part of the perforated panel plywood. Ž<P>SOLUTION: A floor panel plywood can be fixed to a horizontal and low floor by adjusting the height of the adjusting bolts with an injection hole for the perforated panel plywood to the uneven parts of the RC floor slab at direct sticking to a floor. The resin bond injected into the groove portions of a sheet plywood with rule grooves for uniformly filling the resin bond injected from the injection hole is uniformly filled, which enables production of the low-floor horizontal panel plywood substrate. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010065517(A) 申请公布日期 2010.03.25
申请号 JP20080264616 申请日期 2008.09.11
申请人 SHUYA MIEKO 发明人 SHUYA MIEKO
分类号 E04F15/00 主分类号 E04F15/00
代理机构 代理人
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