发明名称 |
Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
摘要 |
Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20μm and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.
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申请公布号 |
US2010075228(A1) |
申请公布日期 |
2010.03.25 |
申请号 |
US20090585146 |
申请日期 |
2009.09.04 |
申请人 |
AIR WATER INC. |
发明人 |
YOSHINAGA NAOTO;WAKAYAMA YOSHIHARU;IBARAKI SATOSHI;SHIMOMURA JUN;MURAGE YOSHIMI;SHIOMI NIRO;KODANI YOSHINOBU;IKEDA TAKAOMI |
分类号 |
H01M4/58;H01B1/24;H01G11/24;H01G11/38;H01G11/42 |
主分类号 |
H01M4/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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