| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor package, which not only facilitates formation of a solder fillet but also enhances the bonding strength between an external terminal and a mounting substrate, and to provide a semiconductor package. Ž<P>SOLUTION: An outer lead 3 of the semiconductor package extends in parallel with a printed circuit board, and a groove approximately reaching a half of the outer lead 3 from an upper surface 3a is formed in a front end part of the outer lead 3, and a projection 10 defined by a bottom 5x and a sidewall 5y of the groove constitute a step for a cut surface 6. A semicircular recess 4 for the cut surface 6 is formed in a front end center part of the outer lead 3 throughout from the upper face 3a to a lower face 3b. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
