| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate for a probe card capable of simplifying a process by leading out a conductive part from the rear surface side to the front surface side of the substrate without depending on multilayer wiring, and designing wiring easily. Ž<P>SOLUTION: The method has processes for (I) providing a block having a prescribed height on a prescribed domain on the surface of an insulating layer on which an electrode is formed; (II) bonding the electrode to the upper surface of the block by a bonding wire; (III) burying the bonding wire by an insulator, and fixing the insulator; (IV) grinding the fixed insulator and the buried bonding wire, and thereby exposing a ground surface of the bonding wire on the surface of the insulator. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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