| 发明名称 |
SEMICONDUCTOR PACKAGE SYSTEM WITH DIE SUPPORT PAD |
| 摘要 |
A semiconductor package system includes: providing a leadframe with a lead; making a die support pad separately from the leadframe; attaching a semiconductor die to the die support pad through a die attach adhesive, the semiconductor die being spaced from the lead; and connecting a bonding pad on the semiconductor die to the lead using a bonding wire.
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| 申请公布号 |
US2010072589(A1) |
申请公布日期 |
2010.03.25 |
| 申请号 |
US20080235144 |
申请日期 |
2008.09.22 |
| 申请人 |
CAMACHO ZIGMUND RAMIREZ;MERILO DIOSCORO A;TAY LIONEL CHIEN HUI |
发明人 |
CAMACHO ZIGMUND RAMIREZ;MERILO DIOSCORO A.;TAY LIONEL CHIEN HUI |
| 分类号 |
H01L21/60;H01L23/495 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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