发明名称 |
QUAD FLAT PACK IN QUAD FLAT PACK INTEGRATED CIRCUIT PACKAGE SYSTEM |
摘要 |
An integrated circuit package system includes: providing a base package having a first integrated circuit with an inner lead on a periphery thereof and connected thereto with interconnects, and the inner lead partially encapsulated by an inner encapsulation; mounting an outer lead on the periphery of the base package; mounting a second integrated circuit above the base package and connected to the outer lead with the interconnects; and partially encapsulating, the base package and the outer leads with an outer encapsulation leaving a bottom surface of the inner lead and a bottom surface of the outer lead exposed.
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申请公布号 |
US2010072586(A1) |
申请公布日期 |
2010.03.25 |
申请号 |
US20080236437 |
申请日期 |
2008.09.23 |
申请人 |
MERILO DIOSCORO A;DIMAANO JR ANTONIO B |
发明人 |
MERILO DIOSCORO A.;DIMAANO, JR. ANTONIO B. |
分类号 |
H01L23/495;H01L21/56 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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