发明名称 Metallization on a surface and in through-holes of a substrate and a catalyst used therein
摘要 A copolymer deposited with particles of catalytic metal is disclosed in the present invention, which is formed from an ethylenically unsaturated monomer and a hydrophilic monomer, and the catalytic metal is Au, Ag, Pd, Pt or Ru. The copolymer is hydrophilic when the temperature is lower than a specific temperature, and will become hydrophobic when the temperature is greater than the specific temperature. The present invention also discloses a method for forming a metal layer on a substrate via electroless plating, which includes contacting the substrate with an ink composition, drying the ink composition on the substrate, and contacting the dried ink composition with an electroless plating solution, wherein the ink composition contains the copolymer of the present invention in an aqueous phase. The present invention further discloses a method for forming metal conductors in through holes of a substrate.
申请公布号 US2010075026(A1) 申请公布日期 2010.03.25
申请号 US20080289542 申请日期 2008.10.30
申请人 NATIONAL DEFENSE UNIVERSITY 发明人 SUNG YUH;GER MING-DER;CHANG CHANG-PIN;TSENG CHUN-CHIEH;CHEN WEN-DING
分类号 C08K3/08;B05D3/10;H01C17/00 主分类号 C08K3/08
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