| 摘要 |
A semiconductor chip which includes an element forming region formed over a substrate, a scribe line region which surrounds the element forming region, and a structure provided locally inside the scribe line region in at least one corner area of the semiconductor chip. The element forming region and the scribe line region include a plurality of interlayer dielectric films laminated over the substrate. The structure is constituted of corner pads sandwiching at least one of the interlayer dielectric films vertically in the direction of lamination, and vias interconnecting the corner pads. |
