Substrate for development of electronic components, particularly light emitting diode from punched copper-colored metal foil and non-metallic foil, includes coating copper-colored metal foil with metal

摘要

The substrate includes coating copper-colored metal foil with a metal, where the metal has a white tinted surface structure. The white surface has silver, where white surface coating is thinner than twenty micrometers. Independent claims are included for the following: (1) a method for manufacturing laminate from punched metal film and a non-metallic foil for electronic components; and (2) a method for manufacturing laminate as bearing for electronic components by using punched copper-colored metal foil and non-metallic foil.