发明名称 EXPOSURE METHOD AND APPARATUS, AND METHOD FOR MANUFACTURING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To switch an illumination condition at high speed, and to correct an imaging characteristic at high speed according to the illumination condition. <P>SOLUTION: In the exposure method that exposes a pattern of a reticle R with an illumination light IL and a wafer W via a projection optical system PL, an intensity distribution of the illumination light IL on a lighting pupil surface PP1 is controlled according to the pattern of the reticle R by a spatial light modulator 13 having a plurality of tilt angle variable mirror elements 3, and a correction illumination light LB having a wavelength region different with that of the illumination light IL is radiated to lenses L2A and L2B comprising the projection optical system PL from correction irradiation systems 40A and 40B with a distribution according to the intensity distribution. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010067866(A) 申请公布日期 2010.03.25
申请号 JP20080234064 申请日期 2008.09.11
申请人 NIKON CORP 发明人 INOUE HIDEYA;SHIBUYA KEI
分类号 H01L21/027;G02B19/00;G03F7/20 主分类号 H01L21/027
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