发明名称 POSITIONING APPARATUS AND METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a positioning apparatus solving positioning errors on the basis of position information of a processing face of a substrate. <P>SOLUTION: A surface state measuring part (microscope camera 9, surface measuring part 53a) observes the surface state of the substrate to be measured as image data. A position measuring part 53b measures the positions of an inkjet head 10 and the surface state measuring part. A memory 53c previously stores the surface state of the substrate. An error amount calculating part 53d obtains a moving error amount by comparing a surface state predicted by obtaining the predicted surface state of the substrate after movement from the memory 53c with a surface state measured with the surface state measuring part at a position after movement on the basis of the position before movement of the surface state measuring part measured with the position measuring part 53b and a movement amount of the surface state measuring part in movement of the inkjet head 10. A position correction part 53e corrects the position of the inkjet head 10, based on a movement error amount obtained with the error amount calculating part 53d. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010066213(A) 申请公布日期 2010.03.25
申请号 JP20080234908 申请日期 2008.09.12
申请人 SHARP CORP 发明人 IWATA YUTAKA
分类号 G01B11/00;G02B5/20;G02F1/13;G02F1/1335;G09F9/00 主分类号 G01B11/00
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