| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for mounting an electronic component that can adequately respond to fast mounting requirements. <P>SOLUTION: A nozzle 11 is lowered so that the electronic component 12 which is sucked up by the nozzle 11 may approach a pad 14 on which a viscous bonding material 15 is applied. When the space between the electronic component 12 approaching the pad 14 and the viscous bonding material 15 gets within a predetermined distance L, the nozzle 11 is stopped lowering and a predetermined positive pressure PP is acted on to a nozzle hole 11a, and the electronic component 12 is blown off from the nozzle 11 to the pad 14 to get attached to the viscous bonding material 15. When a predetermined time Tpp passes after the predetermined positive pressure PP has been acted on to the nozzle hole 11a, the action of the predetermined positive pressure PP onto the nozzle hole 11a is stopped and the nozzle 11 is elevated from the stopped position. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
