| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of forming wiring which can form appropriate wiring enough to electrically connect laminated substrates with each other and also attains high lamination of the substrates. <P>SOLUTION: The method of forming wiring includes a conductive layer forming step wherein: conductive ink is used as ink I; voltage is applied between a print head 2 and a substrate unit 10; while the substrate unit 10 is inclined so that an angle θ formed by a normal line of the side face 11b of the substrate 11 exposing over an ink discharge face 211c of the print head 2 and the ink discharge face 211c may be less than a right angle, the substrate unit 10 and the print head 2 are relatively moved in nearly parallel direction to the ink discharging face 211c; at the same time, an ink drop R of the conductive ink is discharged from the print head 2 so that a conductive layer 12 for electrically connecting electrodes 112 among the substrates 11 is formed like wiring on the exposing face. <P>COPYRIGHT: (C)2010,JPO&INPIT |
