发明名称 GRINDER
摘要 PROBLEM TO BE SOLVED: To provide a grinder including a chuck table having a simple construction. SOLUTION: The grinder includes the chuck table 52 for holding a wafer, and a wafer transfer means for loading a wafer to be ground into the chuck table 52 and unloading the ground wafer. The chuck table 52 includes: a suck-holding part 56 for sucking and holding a wafer; a frame body 54 for surrounding the suck-holding part 56; a table base 58 for rotatably supporting the frame body 54; a communication passage 110 formed along the outer periphery of the frame body 54 and communicated to the suck-holding part 56; and an open/close valve 92 that is disposed within the communication passage 110 and switches the communication passage 110 between an open state and a close state. The wafer transfer means includes a suction force transmission part that is engaged with the communication passage 110 and transmits suction force when a suction pad abuts against the suck-holding part 56, and a fluid supply part that causes the wafer to be released from the suck-holding part 56 by supplying a fluid to the suck-holding part 56. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010064208(A) 申请公布日期 2010.03.25
申请号 JP20080234217 申请日期 2008.09.12
申请人 DISCO ABRASIVE SYST LTD 发明人 HIGUCHI DAICHI
分类号 B24B41/06;H01L21/304 主分类号 B24B41/06
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