| 摘要 |
Provided is a socket for semiconductor integrated circuit allowing a semiconductor integrated circuit to be analyzed easily. The socket for semiconductor integrated circuit according to the invention is used by mounting a package thereon. The socket for semiconductor integrated circuit includes: a socket main body which covers both a front-side surface and a back-side surface of the package and is provided with a window formed above either of the two surfaces of the package; bottom-side socket pins provided corresponding respectively to package balls of the package; upper-side socket pins provided corresponding respectively to the package balls of the package at the time when the package is mounted upside down; and wirings which electrically connect the bottom-side socket pins to the corresponding upper-side socket pins, respectively.
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