LIGHT-EMITTING ARRANGEMENT

摘要

The invention relates to a light-emitting arrangement (1) comprising a printed circuit board (6), PCB, having at least one electrically and thermally conductive portion (4), a light- emitting diode, LED (2), being thermally connected to the at least one electrically and thermally conductive portion by at least one contact of the LED, and a heat release member (5) for dissipating heat generated by the LED, the heat release member being thermally connected to the at least one electrically and thermally conductive portion, wherein the heat generated by the LED is transferred along a heat transfer path extending from the LED via the at least one contact and the at least one electrically and thermally conductive portion to the heat release member. The light-emitting arrangement according to the invention provides greatly improved heat removal from the LED while using a low-cost glass-epoxy material for the PCB.